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Document Type : Latin Dissertation
Language of Document : English
Record Number : 151419
Doc. No : ET23211
Main Entry : Bin Wang
Title Proper : CHEMICAL-MECHANICAL PIANARIZATION OF AL,UMINUM AND COPPER INTERCONNECTS WITH MAGNETIC LINERS
Note : This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract : Chemical Mechanical Planarization (CMP) has been employed to achieve Dama-scene patteming of aluminum and copper interconnects with unique magnetic liners. Theliner consists of a magnetic alloy (NiFe or NiFeCo) sandwiched by TiW. with the optionof using TaN in place of TiW for copper interconnects. The magnetic liner reduces thewrite current density in giant magnetoresistance (GMR) memories. by confining the mag-netic flux around the word line. For the realization of aluminum and copper Damascenepatteming with magnetic liners. minimization of metal line dishing. magnetic liner loss.and surface damage as well as the understanding of CMP mechanisms are essential. Thisresearch has established both the processes for fabricating the required Damascene pat-terns and the fundamental mechanisms involved in aluminum. copper. and nickel CMP.A one-step process was developed for each interconnect scheme. using a double-layered pad with mesh cells. pores. and perforations on a top hard layer. Negligible metalline dishing without magnetic alloy loss and absence of visible surface scratching wereachieved on sub-micron features for both aluminum and copper Damascene patterning. Inorder to control line-to-liner and line-to-oxide removal selectivities. a potassium iodate-based slurry was found to be effective for copper interconnects. With the emphasis onreducing surface scratches. a hydrogen peroxide-based slurry was....-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject : Electericl tess
: برق
electronic file name : TL46447.pdf
Title and statement of responsibility and : CHEMICAL-MECHANICAL PIANARIZATION OF AL,UMINUM AND COPPER INTERCONNECTS WITH MAGNETIC LINERS [Thesis]
 
 
 
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