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دانشگاه آزاد اسلامی اصفهان(خوراسگان)
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"
ELECTRICAL CHARACTERIZATION OF PLASMA ENHANCED CVD SILICON NITRIDE DIELECTRIC ON COPPER
"
Document Type
:
Latin Dissertation
Language of Document
:
English
Record Number
:
151212
Doc. No
:
ET23004
Main Entry
:
Amudha lrudayarn
Title Proper
:
ELECTRICAL CHARACTERIZATION OF PLASMA ENHANCED CVD SILICON NITRIDE DIELECTRIC ON COPPER
Note
:
This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract
:
In this work, a novel metal-insulator-metal (MIM) capacitor process is introduced andintegrated in a Copper Interconnect technology, whose smallest feature size is 0.18vm. process,which has good yield, reliability and repeatability. The MIM uses a one-photomask process andhence is termed as the Low-cost-integration (LCI) MIM. The LC1 MIM uses copper as the bottomelectrode, plasma enhanced silicon nitride as the dielectric, and Tantalum nitride as the topelectrode. The target capacitance density is 1.5f~lpm~. The target leakage current is 1e"~hn' at3.3V at 125 . The maximum operating voltages that the MIM is designed for is 5V. The voltagelinearity is desired to be less than 1OOppmiv-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject
:
Electericl tess
:
برق
electronic file name
:
TL46233.pdf
Title and statement of responsibility and
:
ELECTRICAL CHARACTERIZATION OF PLASMA ENHANCED CVD SILICON NITRIDE DIELECTRIC ON COPPER [Thesis]
http://localhost/site/catalogue/151212
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TL46233.pdf
TL46233.pdf
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