CHARACTERIZATION AND PREDICTION OF MATERIAL RESPONSE OF MICRO AND NANO-UNDERFILLS FOR FLIP CHIP DEVICES

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" CHARACTERIZATION AND PREDICTION OF MATERIAL RESPONSE OF MICRO AND NANO-UNDERFILLS FOR FLIP CHIP DEVICES "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	149981
Doc. No	:	ET21773
Main Entry	:	Muhammad Saiful Islam
Title Proper	:	CHARACTERIZATION AND PREDICTION OF MATERIAL RESPONSE OF MICRO AND NANO-UNDERFILLS FOR FLIP CHIP DEVICES
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Silica particles are used as a filler material in electronic underfills to reducecoefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills,the size of silica particles is in the micrometer range. Reduction in particle sizes into thenanometer range has the potential of attaining higher volume fraction particle loading inthe underfills and greater control over underfill properties for higher reliabilityapplications. Presently, no-flow underfills have very low or no filler content becausemicron-size filler particles hinder solder joint formation. Nano-silica underfills have thepotential of attaining higher..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL44956.pdf
Title and statement of responsibility and	:	CHARACTERIZATION AND PREDICTION OF MATERIAL RESPONSE OF MICRO AND NANO-UNDERFILLS FOR FLIP CHIP DEVICES [Thesis]