FABRICATION AND ASSEMBLY OF ULTRA THIN FLEXIBLE

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" FABRICATION AND ASSEMBLY OF ULTRA THIN FLEXIBLE "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	149799
Doc. No	:	ET21591
Main Entry	:	Tan Zhang
Title Proper	:	FABRICATION AND ASSEMBLY OF ULTRA THIN FLEXIBLE
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Directed by Dr. R.Wayne JohnsonTremendous attention has been focused on flexible printed circuits for their lightweight, minimized dimension and three dimensional packaging capabilities. However,the traditional flexible circuit fabrication and assembly process can not meet the demandsfor the continuous reducing of flexible circuit dimensions, while increasing thepackaging density.In this study, an ultra thin polyimide and liquid crystal polymer (LCP) flexibleprinted circuit fabrication process was developed. The circuits had 8 mil line pitch padsand 3 ت 4 mil diameter vias, which is comparable to flexible substrates for high densityinterconnection applications.Thinned silicon flip chip were then assembled on the polyimide and LCP flexibleprinted circuit with a backsidetested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL44766.pdf
Title and statement of responsibility and	:	FABRICATION AND ASSEMBLY OF ULTRA THIN FLEXIBLE [Thesis]