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Document Type : Latin Dissertation
Language of Document : English
Record Number : 148892
Doc. No : ET20684
Main Entry : Fei Ding
Title Proper : FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT
Note : This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract : Flip chip technology offers numerous advantages over conventional packages byvirtue of its electrical performance, greater input/output (I/O) flexibility and small size.This study focuses on two flip chip assembly process developments: large size, fine pitchlead-free capillary flow flip chip and wafer-applied bulk coated flip chip. The assemblyprocess for a lid attached on the backside of the die was also investigated.Large size, fine pitch.
Subject : Electericl tess
: برق
electronic file name : TL43824.pdf
Title and statement of responsibility and : FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT [Thesis]
 
 
 
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