FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT

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" FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	148892
Doc. No	:	ET20684
Main Entry	:	Fei Ding
Title Proper	:	FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Flip chip technology offers numerous advantages over conventional packages byvirtue of its electrical performance, greater input/output (I/O) flexibility and small size.This study focuses on two flip chip assembly process developments: large size, fine pitchlead-free capillary flow flip chip and wafer-applied bulk coated flip chip. The assemblyprocess for a lid attached on the backside of the die was also investigated.Large size, fine pitch.
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL43824.pdf
Title and statement of responsibility and	:	FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT [Thesis]