THE STUDY OF GRAIN GROWTH IN COPPER INTERCONNECTS

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" THE STUDY OF GRAIN GROWTH IN COPPER INTERCONNECTS "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	148595
Doc. No	:	ET20387
Main Entry	:	TRIPTI RAO
Title Proper	:	THE STUDY OF GRAIN GROWTH IN COPPER INTERCONNECTS
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Reliable quantification of microstructural parameters via microscopy is ofprimary importance for the quantization of materials properties, especially for Cu lineswhere Cu is used as an interconnect material for Integrated Circuits (IC). Themicrostructure of inlaid Cu lines has been investigated using transmission electronmicroscopy (TEM) as a function of annealing conditions, effective linewidth and time.A grain-size analysis was carried out for the purpose of studying the effects ofannealing copper lines of effective linewidths of 0.08, 0.12, 0.16, 0.25, 0.50, and 0.75.
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL43519.pdf
Title and statement of responsibility and	:	THE STUDY OF GRAIN GROWTH IN COPPER INTERCONNECTS [Thesis]