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Document Type : Latin Dissertation
Language of Document : English
Record Number : 152113
Doc. No : ET23905
Main Entry : Wei Huang
Title Proper : HotSpot-A Chip and Package Compact Thermal Modeling Methodology for VLSI Design
Note : This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract : To deal with the challenges of managing the ever-increasing power densities and tem-peratures of VLSI systems, thermal models have become more and more important for per-forming thermal analysis during design time. Due to their lumped thermal R-C network na-ture, compact thermal models are simple and efficient for thermal analysis in VLSI design,especially during early design stages, where detailed layout information is not available..
Subject : Electericl tess
: برق
electronic file name : TL48051.pdf
Title and statement of responsibility and : HotSpot-A Chip and Package Compact Thermal Modeling Methodology for VLSI Design [Thesis]
 
 
 
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