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Document Type : Latin Dissertation
Language of Document : English
Record Number : 152000
Doc. No : ET23792
Main Entry : AASUTOSH D DAVE
Title Proper : MICROMACHINED INFRARED SENSORS WITH DEVICE-LEVEL ENCAPSULATION
Note : This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract : Novel emerging semiconductor technologies and applications are driving theMEMS devices to shrink in size. Packaging is an essential and integral part for a MEMSdevice, which impacts their overall cost, size, and performance. This calls for newpackaging techniques to reduce the cost of packaging for MEMS devices, withoutdeteriorating their performance. One such novel design for device-level encapsulation(self-packaged) of uncooled infrared (IR) microbolometers has been developed.Device-level vacuum encapsulation has the potential to eliminate some majorproblems associated with the bolometer performance such as high thermal conductance.............-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject : Electericl tess
: برق
electronic file name : TL47052.pdf
Title and statement of responsibility and : MICROMACHINED INFRARED SENSORS WITH DEVICE-LEVEL ENCAPSULATION [Thesis]
 
 
 
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