DEVELOPMENT OF NEW HEAT SINK TECHNOLOGY FOR HIGH DENSITY MICROPROCESSORS

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" DEVELOPMENT OF NEW HEAT SINK TECHNOLOGY FOR HIGH DENSITY MICROPROCESSORS "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151781
Doc. No	:	ET23573
Main Entry	:	PEDRO LOPEZ
Title Proper	:	DEVELOPMENT OF NEW HEAT SINK TECHNOLOGY FOR HIGH DENSITY MICROPROCESSORS
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Lopez, Pedro, Development of New Heat Sink Technoloqv For Hiah DensitvMicroprocessors. Masters of Science (MS), May, 2003, 200 pp., 11 tables, 23illustra!ions, references, 55 titles.This study investigates the performance of existing heat sinks and compares itwith two heat-exchanger prototypes: aluminum-foam heat sink and PCM (phase-change material)-filled heat sink. Kapton flexible heaters are used to replicatethe heat produced by a computer's CPU (central processing unit). A number ofthermocouples are connected between the heater and the heat sink being usedto measure the component's temperature. The thermocouples are alsoconnected to a data acquisition card to collect the data using a LabVlEWprogram. The values obtained are compared to data published in literature tovalidate the experiments and the setup. This setup is then utilized to test thenew heat exchangers and compare their performance to that of the existing heatsinks.........-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46815.pdf
Title and statement of responsibility and	:	DEVELOPMENT OF NEW HEAT SINK TECHNOLOGY FOR HIGH DENSITY MICROPROCESSORS [Thesis]