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Document Type : Latin Dissertation
Language of Document : English
Record Number : 151345
Doc. No : ET23137
Main Entry : Rekha S. Pai
Title Proper : ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES
Note : This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract : The process methodology for fabricating high-aspect ratio structures forMEMS microstructures using nickel electroplating has been developed. High-aspect ratio in this thesis refers to structures with aspect ratios greater than 4.Electroplating is carried out selectively on photolithographically patternedsubstrates with a seed layer. A seed layer of gold (100 nm) with an adhesionlayer of chromium (1 0 nm) was found to give the best results for nickelelectroplating on silicon wafers. The molds for creating the high-aspect ratiostructures were made using Shipley's SPR220 positive resist. SPR220 resistwas characterized and molds having smallest feature sizes of 1 pm and heightst 10 pm were fabricated. Two types of solutions, namely Technic 'S' NickelSulfamate solution and a homemade solution of nickel sulfate, were investigated.....-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject : Electericl tess
: برق
electronic file name : TL46373.pdf
Title and statement of responsibility and : ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES [Thesis]
 
 
 
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