ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES

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" ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151345
Doc. No	:	ET23137
Main Entry	:	Rekha S. Pai
Title Proper	:	ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	The process methodology for fabricating high-aspect ratio structures forMEMS microstructures using nickel electroplating has been developed. High-aspect ratio in this thesis refers to structures with aspect ratios greater than 4.Electroplating is carried out selectively on photolithographically patternedsubstrates with a seed layer. A seed layer of gold (100 nm) with an adhesionlayer of chromium (1 0 nm) was found to give the best results for nickelelectroplating on silicon wafers. The molds for creating the high-aspect ratiostructures were made using Shipley's SPR220 positive resist. SPR220 resistwas characterized and molds having smallest feature sizes of 1 pm and heightst 10 pm were fabricated. Two types of solutions, namely Technic 'S' NickelSulfamate solution and a homemade solution of nickel sulfate, were investigated.....-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46373.pdf
Title and statement of responsibility and	:	ELECTROPLATING FOR LAB-ON-AICHlP ELECTRODES AND THREE DIMENSIONAL MEMS MICROSTRUCTURES [Thesis]