SPICE BASED aEAT TRANSPORT MODEL FOR NON-INTRUSIVE THERMAL DLACONSTIC APPLICATIONS

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" SPICE BASED aEAT TRANSPORT MODEL FOR NON-INTRUSIVE THERMAL DLACONSTIC APPLICATIONS "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151289
Doc. No	:	ET23081
Main Entry	:	Michael Stelzer
Title Proper	:	SPICE BASED aEAT TRANSPORT MODEL FOR NON-INTRUSIVE THERMAL DLACONSTIC APPLICATIONS
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Nondestructive material testing and diagnostics play an important role in reliabilityanalysis component wear-out testing, lifwycle estimates, and safety inspections. Of theseveral techniques available for nondestructive inspections, thermal analysis has beenchosen to be the focus of this thesis research. An equivalence between the system ofequations for the heat flow problem, and the variables of circuit theory suggests that anelectrid model can be constructed to represent the actual thermal system. This electricalmodel is constructed based upon a finite difference discretization of the heat flowequation. Using these associations a basic one-dimensional electrical model has beenconstructed and linked.-....,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46315.pdf
Title and statement of responsibility and	:	SPICE BASED aEAT TRANSPORT MODEL FOR NON-INTRUSIVE THERMAL DLACONSTIC APPLICATIONS [Thesis]