VALIDATION OF ELECTRONIC PACKAGE RELIABILITY USING SPECKLE INTERFEROMETRY

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" VALIDATION OF ELECTRONIC PACKAGE RELIABILITY USING SPECKLE INTERFEROMETRY "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151096
Doc. No	:	ET22888
Main Entry	:	Kevin Joseph Cote
Title Proper	:	VALIDATION OF ELECTRONIC PACKAGE RELIABILITY USING SPECKLE INTERFEROMETRY
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	In-situ measurements were performed on a land grid array electronic packageusing Electronic Speckle Pattern Interferometry. Unlike other whole field deformationtechniques such as MoirC Interferometry, w-hich is typically used by the electronicpackaging industry, Electronic Speckle Pattern Interferometry does not require a thinfilm grating to be applied to the specimen. Moreover, this grating can often skew themeasurements if not applied properly.Due to coefficient of thermal expansion mismatches between the package andprinted circuit board, creep shear strains developed in the 63/37 SnPb solder. Whenthermally loaded, these creep shear strains develop cracks in the joint leading to ModeII failure. A single thermal half cycle &om 2 5 ' ~ to 1 2 5 ' ~ was applied to a specimento simulate the fatigue Life of the solder joints undergoing thermal loading and theresulting strains were entered into the Engelmaier reliability prediction model for..,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46116.pdf
Title and statement of responsibility and	:	VALIDATION OF ELECTRONIC PACKAGE RELIABILITY USING SPECKLE INTERFEROMETRY [Thesis]