DEVELOPMENT AND CHARACTERIZATION OF A WAFER LEVEL UNDERFlLL APPLICATION PROCESS

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" DEVELOPMENT AND CHARACTERIZATION OF A WAFER LEVEL UNDERFlLL APPLICATION PROCESS "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151048
Doc. No	:	ET22840
Main Entry	:	Chris Quentin
Title Proper	:	DEVELOPMENT AND CHARACTERIZATION OF A WAFER LEVEL UNDERFlLL APPLICATION PROCESS
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	DEVELOPMENT AND CHAR4CTERIZATION OFA WAFER LEVEL UNDERFILL APPLICATION PROCESSBy Christopher G. QuentinUse of flip chip electronic packages is increasing because they offer better electricalperformance than standard wire bonded packages. Currently, their use is limited mainlyto expensive products such as microprocessors because of their high cost. One reason forthe high cost is the die-level application of underfill adhesive.A process for screen printing underfii directly onto a wafer before dicing wasinvestigated. AAer a preliminary study of nine potential underfill materials, one wasselected for detailed investigation of the printing process. Process parameters studiedincluded screen thickness, snapoff height, and squeegee speed. The response parameterswere fdm thickness and average surface roughness. The film thickness was found o bedirectly proportional to the screen thickness. It was aIso observed that the underfillmaterials tended to shear fiom the screen rather than flow fiom the screen as suggestedby earlier theoretical studies...,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46067.pdf
Title and statement of responsibility and	:	DEVELOPMENT AND CHARACTERIZATION OF A WAFER LEVEL UNDERFlLL APPLICATION PROCESS [Thesis]