LEAD FREE SOLDERING MATERIALS, RELIABILITY AND PROCESS OPTIMIZATIONI

دانشگاه آزاد اسلامی اصفهان(خوراسگان)

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" LEAD FREE SOLDERING MATERIALS, RELIABILITY AND PROCESS OPTIMIZATIONI "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	151013
Doc. No	:	ET22805
Main Entry	:	HEMANT BELBASE
Title Proper	:	LEAD FREE SOLDERING MATERIALS, RELIABILITY AND PROCESS OPTIMIZATIONI-
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	As the European and global marketplaces consider mandating lead-free electronicequipment. many questions arise about the technical feasibility of replacing lead inPrinted Wiring Board (PWB) soldering applications. It is the purpose of this thesis toevaluate various emerging alternatives to lead-based solders and finishes and torecommend a viable lead-free alternative to lead based processes.The various alternatives of lead-free materials, surface finishes and manufacturingprocesses were evaluated. then reduced to a more manageable set of factors and levels.These factors were combined in a set of designed experiments and analyzed, incomparison to a baseline of standard leaded processes and materials, using the qualitycharacteristics of visual, mechanical and thermal testing criteria.The results showed that P W B assembly with zero defects and stronger solder joints..,....-...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL46031.pdf
Title and statement of responsibility and	:	LEAD FREE SOLDERING MATERIALS, RELIABILITY AND PROCESS OPTIMIZATIONI- [Thesis]