Thermal and Power Integrity Analysis and Optimization for High Performance VLSI

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" Thermal and Power Integrity Analysis and Optimization for High Performance VLSI "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	150265
Doc. No	:	ET22057
Main Entry	:	Ting-Yuan Wang
Title Proper	:	Thermal and Power Integrity Analysis and Optimization for High Performance VLSI
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	The ever-increasing demands for more functionality and higher speed have pushed the VLSIindustry towards more aggressive scaling. Since this trend leads to higher current density andpower dissipation in power/ground (PIG) network, the voltage fluctuations on the on-chippower distribution system are becoming a crucial factor in determining the performance andthe reliability of VLSI designs. A complete picture of the power grid integrity can be obtainedonly when IR-drop, electromigration (EM), and thermal effect are all considered together.However, traditional P/G network design methodologies aim at minimizing the total routingarea subject to El4 and IR-drop constraints. Thermal effect is ignored in the design, and cancause thermally-induced performance and reliability issues. Therefore, we propose an algorithmfor PIG network design with thermal integrity. The basic idea is to include the thermal effectin optimization process. To consider thermal effect in IR-drop, IR-drop constraint must betemperature dependent. In addition, a new self-consistent constraint is defined and used to...,..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL45254.pdf
Title and statement of responsibility and	:	Thermal and Power Integrity Analysis and Optimization for High Performance VLSI [Thesis]