LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE PACKAGES AND 01005 COMPONENTS

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" LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE PACKAGES AND 01005 COMPONENTS "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	149984
Doc. No	:	ET21776
Main Entry	:	Yueli Liu
Title Proper	:	LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE PACKAGES AND 01005 COMPONENTS
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	Chip Scale Packages (CSPs) are widely used in portable and hand-held electronicdevices due to their small size and availability. Consumers expect portable products tosurvive being dropped repeatedly, and drop testing is now common in the reliabilityevaluation of portable product designs. Lead-free assembly is another trend in electronicsindustries because of legislation and market factors.Underfill materials are often used to improve the reliability of a variety ofelectronic components. In this research, the assembly processes for three underfill options(capillary underfill, fluxing underfill and corner bond underfill) compatible with lead-freeassembly have been developed and evaluated. CSPs with eutectic SnPb and withoutv..tested for theQ1 PC1 bus cardBoth these projects mere sofixare des elopment efforts tonards contributing to dlfferentaspects of Roboucs and lZ1echatronics projects m the Controls and Roboucs Group..
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL44959.pdf
Title and statement of responsibility and	:	LEAD-FREE ASSEMBLY AND RELIABILITY OF CHIP SCALE PACKAGES AND 01005 COMPONENTS [Thesis]