COMPACT MODULAR ASSEMBLY AND PACKAGING OF MULTI- SUBSTRATE MICROSYSTEMS (WIMS CUBE)

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" COMPACT MODULAR ASSEMBLY AND PACKAGING OF MULTI- SUBSTRATE MICROSYSTEMS (WIMS CUBE) "

Document Type	:	Latin Dissertation
Language of Document	:	English
Record Number	:	149324
Doc. No	:	ET21116
Main Entry	:	Asli Burcu Ucok
Title Proper	:	COMPACT MODULAR ASSEMBLY AND PACKAGING OF MULTI- SUBSTRATE MICROSYSTEMS (WIMS CUBE)
Note	:	This document is digital این مدرک بصورت الکترونیکی می باشد
Abstract	:	This research has developed a new approach for the assembly and packaging ofmicrosystems consisting of multiple substrates containing circuits, sensors, and actuatorsin a rcworkable and modular fashion. The microsystem dice are stacked on top of oneanother inside a cube called the WIMS Cube (Wireless Integrated Microsystems), are.
Subject	:	Electericl tess
	:	برق
electronic file name	:	TL44264.pdf
Title and statement of responsibility and	:	COMPACT MODULAR ASSEMBLY AND PACKAGING OF MULTI- SUBSTRATE MICROSYSTEMS (WIMS CUBE) [Thesis]